ASE Technology and Amkor Technology both reported strong first-quarter 2026 results driven by AI-fueled demand for advanced semiconductor packaging, but ASE Technology holds the edge in growth, profitability, and earnings outlook. ASE Technology posted NT$173.7 billion in revenue, up 17% year over year, with its Assembly, Testing and Material business reaching a record NT$112.4 billion, while Amkor achieved record revenue of $1.68 billion, a 27% increase. ASE Technology shares have surged 149.8% year to date, outpacing Amkor's 99.4% gain, and analysts expect ASE Technology's earnings per share to grow 47.4% in 2026 and another 73.2% in 2027, compared with Amkor's projected 38.7% growth this year and just 3.7% next year. ASE Technology also trades at a slightly lower forward price-to-earnings multiple of 35.33 times versus Amkor's 37.11 times, while both stocks carry premium valuations relative to the industry average of 33.61 times. The analysis concludes that ASE Technology's faster revenue growth, superior margin profile, stronger AI-driven momentum, and better long-term earnings trajectory make it the more compelling investment in the chip packaging space.
Teradyne Launches Titan HP Platform With Burn-In for AI Data Center Chips
Teradyne announced a production-ready system that adds enhanced burn-in capabilities to its Titan HP platform, aimed at high-power AI, automotive, and other high-reliability devices. The platform holds each device at its target junction temperature while running a realistic device workload, rather than the traditional method of holding devices in banks of dedicated ovens at a controlled air temperature for hours before functional test. Teradyne said the approach can lower cost of test, reduce factory floor space, and improve time to market, and that Titan HP can be used for either system level test or reliability testing. Jason Zee, vice president and general manager of Teradyne's Integrated Systems Test division, said customers are being asked to ship high-power AI silicon at reliability levels that used to belong to automotive. The platform's asynchronous slot architecture loads and tests each slot independently, and test programs run on the Teradyne Atlas software platform. Teradyne Titan HP with enhanced burn-in is available today and deployed in production.
Semiconductors › Advanced Packaging & Test (OSAT) ▲Technology
TER · Technology · Positive Teradyne launched its production-ready Titan HP platform with enhanced burn-in for high-power AI data center chips, a new product development.
JPMorgan Starts Technoprobe at Overweight, Shares Hit 3-Month High
J.P. Morgan initiated coverage of Technoprobe SpA with an overweight rating, sending the Italian semiconductor-testing supplier's shares up 4.13% to €37.32, their highest level since June 22. The brokerage set a June 2028 price target of €45, based on a 28-times 2028 estimated EBIT multiple, saying the premium to semiconductor-capital-equipment peers is justified by Technoprobe's stronger and more durable growth and margins. J.P. Morgan forecasts revenue rising from €628 million in 2025 to €1.09 billion in 2026 and €1.66 billion in 2027, with adjusted EBIT increasing from €136 million to €449 million and €810 million, respectively, and adjusted EPS of €0.54 in 2026, €0.96 in 2027 and €1.19 in 2028, versus Bloomberg consensus of €0.54, €0.79 and €1.00. The brokerage highlighted Technoprobe's roughly 60% share of the Vertical MEMS testing market, a technology increasingly used for advanced logic chips that could gain adoption in memory as architectures such as HBM4E and HBM5 become more complex. J.P. Morgan said further capacity expansion is the key watchpoint for additional earnings upgrades; Technoprobe is targeting production capacity equivalent to a roughly €1.6 billion annual revenue run-rate by the end of the first quarter of 2027, with further expansion beyond that level still being assessed with customers.
Teradyne Launches Magnum E2 Memory Tester as Memory Revenue Hits Record $212 Million
Teradyne has launched the Magnum E2, a next-generation high-speed memory test system built on its Near-DUT Test architecture, supporting advanced DRAM and flash interfaces including LPDDR6, DDR6, GDDR7 and NAND flash. The platform offers higher parallelism, improved signal integrity and support for NRZ, PAM3 and PAM4 signaling, and combines memory and logic testing on a single platform. The launch expands Teradyne's memory test portfolio, led by its Magnum platforms, as the company competes with KLA and Cohu in the semiconductor test-equipment market. In the second quarter of 2026, Teradyne's memory revenues reached a record $212 million, the third consecutive quarter above $200 million, with memory book-to-bill exceeding 2. Management expects the 2026 memory test TAM to be more than 40% higher than 2025 and expects memory revenues to grow in the second half compared to the first half. KLA reported record fourth-quarter fiscal 2026 revenues of $3.66 billion, up 15% year over year and 7% sequentially, while Cohu is extending its Neon inspection platform across HBM3, HBM4 and HBM4E production.
Semiconductors › Advanced Packaging & Test (OSAT) Technology
TER · Capital · Positive Teradyne's memory revenues hit a record $212M in Q2 2026, third straight quarter above $200M, with book-to-bill above 2 and expected H2 growth.
TER · Technology · Positive Teradyne launched the Magnum E2 next-generation high-speed memory test system supporting LPDDR6, DDR6, GDDR7 and NAND flash.
COHU · Competition · Neutral Mentioned only as a competitor extending its Neon inspection platform across HBM3/HBM4/HBM4E, no impact on Cohu stated.
KLAC · Capital · Neutral Reported record Q4 fiscal 2026 revenues of $3.66B, up 15% YoY, but only as context alongside Teradyne's memory test news.
Infineon opens semiconductor plant in Thailand with investment of over 48 billion baht
Infineon Technologies Manufacturing (Thailand) opened a new plant in Samut Prakan province on October 1, 2026, with Prime Minister Anutin Charnvirakul presiding over the ceremony, joined by Deputy Prime Minister and Finance Minister Ekniti Nitithanprapas. The plant received investment promotion from the BOI with an investment value of over 48 billion baht, covering the production of power control chip systems, integrated circuit and wafer testing, as well as research and development of semiconductor products. The plant is Infineon's third power control chip system production base, following Germany and China, starting with phase 1 and with plans to expand up to 5 phases. If all 5 phases are completed, it will be Infineon's largest assembly and testing production base in the world, with a total cleanroom area of 150,000 square meters, roughly twice the size of the company's current largest plant. Infineon plans to employ more than 5,000 Thai personnel in total, or approximately 1,000 people per phase, while the BOI has set conditions requiring the development of more than 600 Thai personnel in science and technology and the sending of more than 130 Thai personnel for specialized technology training abroad.
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IFX.XETRA · Supply · Positive Infineon opened a new Thai plant expanding power-chip assembly, testing and R&D capacity, with plans for up to 5 phases making it its largest assembly/test base.
Infineon opens new semiconductor plant in Thailand with total project cost of 1.4 billion dollars
German semiconductor giant Infineon Technologies opened a new plant in Thailand on the first of the month. The new facility on the outskirts of Bangkok is a back-end site handling semiconductor assembly and testing, with an initial investment of more than 100 million euros, or 113.57 million dollars, while the total project value reaches 1.4 billion dollars according to a statement from Thailand's Board of Investment. According to Infineon Chief Operating Officer Alexander Gorski, the site initially features cleanrooms, the controlled environments required for semiconductor manufacturing, of up to 30,000 square meters, and can be expanded to as much as 150,000 square meters in the future. Gorski said this is a strategic long-term investment and cited Thailand's proximity to major markets such as China as a strength. According to Gorski, Infineon has 13 manufacturing sites in the United States, Europe, China and Southeast Asia, and leveraging existing cleanroom capacity could potentially double its revenue. The expansion in Thailand is also part of efforts to offer customers dual sourcing, and Narit, secretary-general of the Board of Investment, said the agency is focusing on photonics, power semiconductors and sensors as part of a long-term strategy in the semiconductor field, aiming to attract 18 billion dollars in semiconductor investment by 2030.
Semiconductors › Advanced Packaging & Test (OSAT) Supply
IFX.XETRA · Capital · Positive Infineon opened a new back-end assembly and testing plant in Thailand, a $1.4B total project investment expanding its manufacturing capacity.
Infineon Opens Backend Manufacturing Hub in Bangkok, Targeting Up to 1,000 Jobs
Infineon Technologies AG officially inaugurated its new backend manufacturing site in Bangkok, Samut Prakan, together with Anutin Charnvirakul, Prime Minister of Thailand, and Alexander Gorski, Chief Operations Officer of Infineon Technologies. The greenfield facility is built for phased expansion and can scale up to five modules, giving Bangkok the potential to become one of Infineon's largest backend manufacturing sites over time; it currently employs around 350 people and is expected to grow to approximately 1,000 employees as the first building, Module A, ramps up. The site covers the full spectrum of semiconductor backend processes as well as wafer test, complementing the ongoing expansion of Infineon's frontend manufacturing capacities and serving automotive, industrial and energy infrastructure applications. The Bangkok site runs on 100 percent green electricity and incorporates water recycling, rainwater collection and on-site solar modules. Infineon had around 57,000 employees worldwide at the end of September 2025 and generated revenue of about €14.7 billion in its 2025 fiscal year.
Electrification & Mobility › EV Powertrain & Power Electronics ▲Supply
Electrification & Mobility › EV Power Semiconductors (SiC / IGBT) Supply
Semiconductors › Advanced Packaging & Test (OSAT) ▼Supply
IFX.XETRA · Supply · Positive Infineon inaugurated a new Bangkok backend manufacturing site that can scale to five modules, expanding its backend capacity and complementing frontend expansion.