Chipown announced that the company has completed the issuance of its first tranche of 2026 sci-tech innovation bonds, with a total issuance size of 600 million yuan. The raised funds were fully received on July 31, 2026. The bond, abbreviated as "26 Chipown MTN001 (Sci-Tech Innovation Bond)", has a maturity of 1+1 years, a coupon rate of 1.60%, an interest accrual date of July 31, 2026, and a redemption date of July 31, 2028. Bank of Ningbo acted as the lead underwriter and bookrunner for this bond, with joint lead underwriters including Minsheng Bank, Industrial Bank, Bank of Shanghai, Bank of Nanjing, and Bank of Jiangsu.
Wuxi Chipown Micro-electronics LtdCompleted 600 million yuan bond issuance, securing financing.