H&T Plans to Issue Up to 2.2 Billion Yuan in Sci-Tech Innovation Exchangeable Corporate Bonds

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H&T announced that its board of directors has approved a plan for a private placement of sci-tech innovation exchangeable corporate bonds, with a total issuance amount of no more than 2.2 billion yuan and a term of no more than three years. After deducting issuance expenses, the proceeds are intended to be used to repay bank loans. The underlying shares for the bonds are the A-shares of Chengchang Technology held by H&T. The proposal still needs to be submitted to the shareholders' meeting for review.

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