New Hope's 500 Million Yuan Sci-Tech Innovation Bond to Repay Principal and Interest on July 21

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New Hope Liuhe announced that its 2025 third tranche sci-tech innovation bond, aimed at rural revitalization, will repay principal and interest on July 21, 2026. The bond was issued with a size of 500 million yuan, a tenor of 270 days, and a coupon rate of 1.8 percent. The total principal and interest due for this period is 506,657,534.25 yuan. The lead underwriters are Industrial Bank, Bank of Communications, Bank of Tianjin, and China Bohai Bank.

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New Hope Liuhe Co Ltd
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Bond repayment is a routine financial obligation; no material impact on operations or valuation.