Qualcomm wins BMW chip supply deal for future vehicle platforms

Infineon Technologies Manufacturing (Thailand) opened a new plant in Samut Prakan province on October 1, 2026, with Prime Minister Anutin Charnvirakul presiding over the ceremony, joined by Deputy Prime Minister and Finance Minister Ekniti Nitithanprapas. The plant received investment promotion from the BOI with an investment value of over 48 billion baht, covering the production of power control chip systems, integrated circuit and wafer testing, as well as research and development of semiconductor products. The plant is Infineon's third power control chip system production base, following Germany and China, starting with phase 1 and with plans to expand up to 5 phases. If all 5 phases are completed, it will be Infineon's largest assembly and testing production base in the world, with a total cleanroom area of 150,000 square meters, roughly twice the size of the company's current largest plant. Infineon plans to employ more than 5,000 Thai personnel in total, or approximately 1,000 people per phase, while the BOI has set conditions requiring the development of more than 600 Thai personnel in science and technology and the sending of more than 130 Thai personnel for specialized technology training abroad.

United Nova Technology released its third-quarter earnings forecast on the evening of the 28th, expecting revenue of approximately 7.766 billion yuan for the first three quarters of 2026, up about 43.23% year on year, with net profit of approximately 681 million yuan, turning from a loss to a profit compared with the same period last year. In institutional research, the company said it had initiated price adjustments in the third quarter across all product categories including MOSFETs, IGBTs, silicon carbide, and analog chips, with an overall adjustment range of 15% to 25%. The price increases have now been fully implemented across all business segments, with an actual blended implementation rate of about 15%, and the revenue and gross margin elasticity from the price increases will begin to show in the third quarter and be released in the fourth quarter. On capacity, United Nova Technology's monthly production capacity for 8-inch silicon carbide wafers has reached 7,000 wafers, with plans to rapidly expand to 15,000 wafers per month. In addition, the company has fully completed its subscribed capital contribution to the joint venture United Nova Advanced, with cumulative paid-in registered capital of 2.129 billion yuan, and a 25.1% stake making it the largest shareholder. The funds are earmarked for the fourth-phase project of United Nova Advanced, which has a total investment of about 20 billion yuan and a capital base of 12 billion yuan, and is planned to build a 12-inch automotive-grade mixed-signal chip production line with monthly capacity of 50,000 wafers. CSC Financial said United Nova Technology has turned profitable and has moved from scale construction into a profit release channel.

The Board of Investment (BOI) disclosed that Infineon Technologies Manufacturing (Thailand) Co., Ltd. will officially open its new plant on October 1, 2026, in Samut Prakan province. The project has received BOI investment promotion worth more than 48 billion baht, covering Power Module production, semiconductor testing, and the establishment of the company's first large-scale semiconductor product research and development center in Thailand. This plant will be the world's third Power Module production base for Infineon Technologies AG, after Germany and China, to serve the electric vehicle, energy systems, and data center markets. The BOI has set conditions requiring the company to develop more than 600 Thai personnel in science and technology, comprising more than 400 production-line engineers and more than 200 research and development staff, along with sending more than 130 Thai personnel for specialized technology training abroad. The company also plans to cooperate with Thai universities to develop no fewer than 60 semiconductor courses, giving more than 1,100 undergraduate students the opportunity to join research and development training through 680 projects, and to conduct joint research with no fewer than 18 domestic universities and research institutes, as well as developing no fewer than 14 Thai entrepreneurs into the global semiconductor supply chain. It plans to spend no less than 2.8 billion baht on research and development in Thailand. Narit Therdsteerasukdi, Secretary-General of the BOI, said this investment reflects that Thailand is building a more complete semiconductor industrial base, in line with the national semiconductor strategy, which aims to attract no less than 500 billion baht in investment in the first five years and increase it to 2.5 trillion baht by 2050, while targeting industry revenue of more than 5 trillion baht per year and creating no fewer than 230,000 additional high-skilled jobs. Currently, Thailand has about 900 operators in the semiconductor and electronics industry, with more than 336,000 personnel. In the first half of 2026, Thailand exported about 1.6 trillion baht in semiconductor and electronic products, or roughly 26% of total exports. From 2023 to June 2026, there were a total of 879 applications for investment promotion in the semiconductor and advanced electronics group, worth more than 909 billion baht, while the printed circuit board industry had 224 promotion applications worth more than 331 billion baht during the same period.

Galaxy Microelectronics announced that the company intends to invest 1.078 billion yuan using its own or self-raised funds to implement a high-end core device industrialization and innovation capability construction project. The project is a continuation of the company's previously disclosed first-phase plant construction project for a high-end integrated circuit discrete device industrialization base, mainly involving renovation, equipment procurement and installation, production line commissioning, and customer verification based on the first-phase plant. The products involved are power discrete devices and third-generation semiconductor devices that use advanced chip structures such as SGT/SJ, IGBT, and SiC/GaN, have passed high-reliability certifications such as AEC-Q101, and target high-barrier scenarios including new energy vehicles, energy storage, and industrial applications. They mainly include SGTMOS, super-junction MOS, IGBT and modules, SiC devices, IPM modules, and automotive-grade TVS/ESD, distinguishing them from traditional consumer-grade small-signal diodes and ordinary low-voltage planar devices.