Sihui Fuji has adjusted the size of its 2026 private placement fundraising, reducing the planned maximum proceeds from 950 million yuan to 930 million yuan, a cut of 20 million yuan. The reduction is due to the deduction of financial investments newly made or planned in the six months before the board resolution date up to the issuance. After deducting issuance expenses, the funds raised will still be entirely directed to the first phase of the project for an annual output of 600,000 square meters of high-multilayer and HDI circuit boards. The total project investment remains unchanged at 1.092 billion yuan, and no other terms of the private placement plan have been altered.
Sihui Fuji Electronics Technology Co LtdCompany lowered its private placement fundraising cap by 20 million yuan, reducing available capital.