Megatrend · Artificial Intelligence

Before any AI chip exists, it has to pass through the "software" and "off-the-shelf blocks" of just a few companies

Everyone knows NVIDIA. But few people know that before any GPU or custom chip can be made, it first has to be "designed" with specialized software called EDA — and is usually assembled from "off-the-shelf blocks" called IP, like Arm's processor cores. This node is the deepest layer of all, the "shovels and picks of the people selling shovels" — and they're selling like never before, because every company is now rushing to design its own AI chip. The game-changer: it's started using AI to design the chips itself.

Category Artificial Intelligence Level Specific topic Layer infrastructure Read time ~13 min
A large architect's table with a chip blueprint spread out. One hand places a ready-made block onto the design, while a glowing design-software screen sits on the other side. It conveys that every chip starts from a design and tools before becoming real silicon.
The blueprint of the AI era. Before there's a chip, there's always a "design" and a "tool to draw it" — this node is the layer that sells both to everyone who wants to build a chip.

01What it is (design tools + IP blocks)

Picture building a skyscraper. Before anyone lays a single brick, two things always come first — (1) design software (CAD) that the architect uses to draw and simulate every floor, and (2) off-the-shelf parts like elevators or steel frames, bought ready-designed from specialists so you don't reinvent them every time. The chip world works exactly the same way, and this node is those two things.

The first is EDA (Electronic Design Automation) — the software engineers use to design, simulate, and verify chips with tens of billions of transistors. Without EDA, no human could design a modern chip by hand — it'd be like drawing a map of an entire country by counting each tree one at a time. The second is Semiconductor IP (pre-designed intellectual-property blocks) — instead of every company inventing a "processor core" from scratch, they buy a ready-made license and assemble it in, like Arm's CPU core or the data-connection blocks (interface IP) used to plug in HBM and PCIe.

On the megatrend map, this node is the deepest leaf under AI Compute & Accelerator Silicon, within the big trend Artificial Intelligence. While siblings like GPU & Merchant Accelerators and Custom Silicon / ASIC are the "actual chips," this node is the layer that comes before all of them — the tools and intellectual raw material used to build those chips. That's why you can call it the "shovels and picks of the people selling shovels."

Key terms
EDA · IP · Tape-out

EDA = automated software for designing, simulating, and verifying a chip's circuits (for example, synthesis turns code into circuits, place-and-route arranges the transistors, and verification hunts for bugs before manufacturing) · IP (Semiconductor IP) = a pre-designed, pre-tested circuit block sold as a "license" to assemble into a chip, like Arm's CPU core · Tape-out = the point where a chip design is complete and sent to the factory (foundry) to be made — like "sending the manuscript to the printer"

02Why it matters — every AI chip passes through this gate first

The first reason is that it's the bottleneck furthest "upstream." Whether the AI chip war ends with NVIDIA's GPUs, AMD's MI chips, or Google and Amazon's custom chips — all of them are designed on EDA software, and most are assembled from the same IP blocks. So this node "collects a toll" from every camp in the arena, without having to guess who wins.

The second reason is that the custom-chip boom is driving this layer's demand directly. There used to be only a few chip-design companies, but today every cloud giant — Google, Amazon, Microsoft, Meta, OpenAI — is pouring effort into designing its own AI chip (see Custom Silicon / ASIC). The more people design chips, the more the sellers of design tools and IP blocks sell. That's why Arm reported its licensing revenue jumped about 70% in the first quarter of fiscal 2025, riding the custom-chip demand.

The EDA software market keeps growing with the wave of AI-chip design
EDA market size ($ billions) — 2031 is a projection, the median across several firms
Source: Mordor Intelligence, Precedence Research, MarketsandMarkets (EDA market 2025–2031, CAGR ~8%)

The third reason is that the value concentrates in "knowledge that's hard to copy." The global EDA market isn't large compared to the chip market (around $12–15 billion a year), yet it props up the entire $600-billion-plus semiconductor industry — software worth tens of billions becomes the key that opens the door to a multi-trillion-dollar core industry. This is a business that's truly "small but mighty."

~$15 billion the annual global size of the EDA software market — tiny next to the $600B+ chip market, but without it no AI chip can be designed at all. It's one of the highest-leverage upstream bottlenecks in the whole industry.
A single narrow tollgate with a long line of trucks carrying chips from many different camps passing through it. It conveys that no matter which camp a chip belongs to, every truck must pass through the same one gate first.
The one gate everyone has to pass. Whether the chip belongs to NVIDIA, AMD, or any cloud giant, every one passes through the same "gate" of design tools and IP blocks first — and this node is the one collecting that toll.

03How it works (from spec to tape-out)

Designing one AI chip doesn't happen in a single step — it's a conveyor belt that flows from "idea" to "the manuscript sent to the factory." This node sells tools and parts at nearly every point on that belt. Let's walk through it step by step.

The chip-design conveyor belt — from spec to tape-out Starting from the chip's spec, EDA software designs, simulates, and verifies it, pulling in ready-made IP blocks like Arm cores along the way, then tape-out sends the design to the factory to be actually made The conveyor belt of designing one chip 1 Spec (what chip to make) 2 EDA: design synthesis + layout 3 EDA: simulate + verify find bugs before manufacturing 4 Tape-out → send to the factory to make ready-made IP block Arm core · interface IP (HBM/PCIe) — slotted in during design
From idea to manuscript. The blue steps are where the EDA software works, and the dashed boxes are the ready-made IP blocks (like Arm cores) pulled in and slotted during design — this node sells both.

What makes this layer "hard" is that modern AI chips are so complex that humans can't keep up — tens of billions of transistors, with every bug needing to be found before tape-out, because a missed mistake on something already manufactured costs tens of millions of dollars to fix. The decades of accumulated know-how in "laying out transistors to be the fastest and most power-efficient" is the wall that keeps the number of companies that can do full-stack EDA down to just a few.

It's the same on the IP side. Designing a CPU core that's stable and compatible with all the world's software takes decades, so buying an Arm core license and slotting it in is vastly faster and safer than rolling your own. And Arm gets paid twice: a license fee at the start of the design, and a royalty collected on every chip sold. The more chips its customers sell, the bigger Arm's cut.

04Where it sits in the ecosystem

If you picture the whole life of an AI chip as a river, this node is the furthest upstream — it comes before everything and feeds everyone downstream.

  • Feeds GPU and Custom Silicon / ASIC directly: both NVIDIA's GPUs and the cloud giants' custom chips are designed on EDA and assembled from IP blocks — especially ASICs, whose design teams are often smaller and so lean especially hard on ready-made IP and automation tools. Every new custom chip is a new order for this layer
  • It's the "design department" of the whole Semiconductors — Logic, Foundry & IP industry: EDA and IP aren't used only for AI chips but for every kind of chip — phones, cars, IoT. This lesson views it through the "AI lens," but if you want the whole-industry picture of EDA/IP, see Semiconductors
  • Hands off to Foundry & Advanced Packaging: the destination of tape-out is the factory. EDA tools have to mesh tightly with TSMC/Samsung's manufacturing processes — design and manufacturing are an inseparable pair
  • Connects with HBM & AI Memory: plugging HBM memory into a chip needs specialized "interface IP" (like Rambus's) — the point where an IP block decides how fast a chip can be fed data
Perspective An easy way to remember it: this node is "before the chip" — the design tools (EDA) + ready-made parts (IP) that every AI chip must pass through before it's born. Unlike its siblings, which are the "chips themselves." What's special is that it doesn't have to pick a side — whichever camp wins the AI chip war, this layer always gets the toll. ⚠️ It overlaps with Semiconductors (EDA & IP) on the tools themselves — the difference is that this lesson focuses specifically on the "AI demand lens."

05Where it stands now

The most shocking thing about the EDA layer is the "three companies control nearly the whole world" level of concentration — Synopsys at about 31%, Cadence about 30%, and Siemens EDA about 13%, together controlling over 70% of the market. Synopsys and Cadence in particular are a "duopoly" almost no one can break into for full-stack design tools — customers can barely switch, because their teams and libraries have been tied to the same tools for years.

All the world's EDA software comes from just 3 companies
Approximate share — Synopsys + Cadence + Siemens EDA together around 74%
Source: SemiAnalysis EDA Market Primer, EDA share analysis (2025) — Synopsys ~31%, Cadence ~30%, Siemens ~13%

2025 saw the biggest deal in the history of design software: in July, Synopsys closed its $35 billion acquisition of Ansys, folding physics simulation into EDA — expanding its addressable market (TAM) to about $31 billion and bringing Synopsys's total revenue (including Ansys) to around $8 billion in 2025. Cadence is at about $5.3 billion.

On the IP side, the star is Arm. In fiscal 2025 its total revenue reached ~$4 billion, and a key milestone was that royalty revenue ($2,168 million) overtook licensing revenue for the first time — a sign that chips using Arm cores are now being made and sold in enormous volumes. Its CSS (Compute Subsystems) program, which helps customers finish a chip design in half the time, has already won 21 licenses from 12 major tech companies by early 2026 — nearly every cloud giant making custom chips relies on Arm's cores.

There are also important specialist players, such as Keysight (test and simulation tools), Rambus (interface IP for high-speed memory), and CEVA (IP for AI/signal work) — each holding its own deep, hard-to-copy niche.

Key players in this field
SynopsysSNPS · US
United States · EDA market leader
The leader in chip-design software (EDA), with about 31% global share. In 2025 it closed the $35 billion acquisition of Ansys, folding physics simulation into EDA, and owns DSO.ai, an AI chip-design tool that has passed 100 tape-outs.
core · EDA market leader
Cadence Design SystemsCDNS · US
United States · the other half of the duopoly
Synopsys's fierce rival, with about 30% EDA share and revenue around $5.3 billion in 2025. Strong in digital design and verification, it launched Cerebrus AI Studio, which claims to speed up designing a whole SoC by about 5×.
core · EDA leader
Arm HoldingsARM · US
UK · king of IP
Owner of the processor cores (CPU IP) found in chips worldwide. In fiscal 2025 revenue reached about $4 billion, and royalty revenue ($2,168 million) overtook licensing for the first time. Its CSS program won 21 licenses from 12 major tech companies — nearly every cloud giant making custom chips relies on Arm's cores.
core · IP leader
Keysight TechnologiesKEYS · US
United States · test/simulation tools
The leader in high-speed signal test and simulation tools, indispensable for designing and verifying modern chips and communication systems — a complementary layer sitting alongside the EDA process.
core · test/simulation
RambusRMBS · US
United States · memory interface IP
A specialist in interface IP for connecting high-speed memory (including HBM) to a chip — the block that decides how fast an AI chip can be fed data. Most of its revenue comes from license fees and royalties.
core · interface IP
CEVACEVA · US
United States · IP for AI/signal work
Licenses specialized IP for signal processing, wireless connectivity, and AI in edge devices — smaller than the big players but holding a niche that grows as AI spreads to end devices.
core · AI/DSP IP

06The road ahead — when AI designs the chips itself

The first direction is the industry's most beautifully "circular" story: AI designing AI chips right back. Modern EDA tools embed AI to help find the best way to lay out transistors — faster, more power-efficient, with fewer engineers. Synopsys's DSO.ai has already passed 100 production tape-outs, while Cadence launched Cerebrus AI Studio, which claims to speed up designing a whole SoC by about 5× — chip-design tools have become both "the seller to the AI era" and "a user of AI" at the same time.

Arm: royalty revenue overtakes license fees for the first time
FY2025 revenue mix ($ billions) — royalty grows with the chips actually made
Source: Arm Holdings FY2025 results (6-K) — royalty $2,168M, total revenue ~$4,000M

The second direction is that the royalty model compounds. The more Arm and other IP sellers have their cores in chips, every chip made and sold pays a royalty back — revenue that grows with the volume of chips worldwide, not just the number of new deals. In an era where every device embeds AI, the base of royalty-paying chips keeps expanding.

A circle of a snake biting its own tail. One side is an AI brain, the other a chip circuit diagram — conveying that AI is used to design chips, and those chips are used to run AI, looping endlessly.
A loop that feeds itself. AI is used to design better chips, better chips run AI harder, and the stronger AI designs even better chips — an accelerating loop for the whole industry.

The third direction is the arrival of chiplets and open standards. Modern chips are starting to be assembled from several "small chips" (chiplets) joined together, instead of cast as one block — making interface IP (the blocks that connect chiplets, like the UCIe standard) much more valuable. There's also the open-architecture wave of RISC-V as an alternative to Arm cores — opening room for newcomers like Andes and VeriSilicon to break into the IP market.

07Challenges & risks

The first risk is exports to China becoming a political hostage. Because EDA is the upstream bottleneck for all chips, it's also a weapon in the tech war. In May 2025, the U.S. ordered Synopsys, Cadence, and Siemens EDA to obtain a license before every sale to China — Synopsys gets about 16% of revenue from China (~$1 billion) and Cadence about 12% (~$550 million), so they were shaken instantly. Even though the order was reversed in July 2025 after China retaliated by restricting rare earths, the episode showed that a big chunk of this layer's revenue hangs on politics that can flip in a few weeks.

The second risk is concentration and reliance on a few customers. With the EDA market held by three companies and Arm the big player on the IP side, this level of concentration means that if major customers (a handful of cloud giants) slow their chip-design plans, or lean more on open alternatives like RISC-V, the leaders' revenue is shaken too — and Arm's own success rides on a few big customers who are now both partners and rivals.

The third risk is the double-edged sword of AI designing chips. AI tools that speed up design are a good selling point, but if they make "chip design so much easier" that small teams or startups can do it themselves, the wall that protected the big three could get lower. In the short term it's a tailwind, but in the long term the technology they built could open the door to new rivals — the classic dilemma of a leader who has to rush to grab the market it's revolutionizing.

The bottom line for beginners EDA & Semiconductor IP is the "shovels and picks of the people selling shovels" — the upstream layer every AI chip must pass through before it's born, with high margins, a high wall, and no need to pick which side wins the chip war. Three keys: (1) the custom-chip boom drives EDA/IP demand directly · (2) AI is becoming both a customer and a tool of this layer — DSO.ai/Cerebrus design AI chips with AI · (3) the biggest risk is the politics of exports to China + concentration. The real value is in "knowledge that's hard to copy," not the software itself.

In short: this node is the deepest and quietest layer of the AI era — no one sees it, but every chip passes through. It sells design tools and ready-made blocks to every camp, collects a toll from the whole arena, and is now using AI to design AI chips in a loop that accelerates the entire industry. Understand this layer, and you understand who's quietly taking a cut behind the scenes "before" every AI chip is even born.

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