SÜSS MicroTec SE

SUSS MicroTec SE has entered the wafer-level cleaning market with the launch of its new GreenTec Solutions product line and its first system, the GT200. The company said the wafer-cleaning market it is targeting represents an addressable market of approximately EUR 5.4 billion, driven by advanced packaging, heterogeneous integration and rising semiconductor demand from AI and high-performance computing. The GT200 is designed for research and development, process qualification and production in 200 mm manufacturing environments for MEMS, RF, Power Device and CMOS applications, and combines the company's TurbulenStrip and CrustBuster process technologies in a single platform. SUSS said the GT200 is the first member of a scalable GreenTec platform and that it will expand toward high-volume manufacturing with a dedicated 300 mm HVM platform in 2027, pulled in from its original schedule due to strong customer interest, followed by a 200 mm HVM platform in 2028. Chief Executive Officer Burkhardt Frick called the launch an important milestone in the execution of the company's Ambition 2030 strategy, while Senior Vice President Photomask Solutions Yuta Nagai said the product line represents its vision for a next generation of semiconductor manufacturing where sustainability and process excellence go hand in hand.