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Artificial Intelligence › Foundry & Advanced Packaging ▲Technology
Semiconductors › Wafer-Fab Equipment & Lithography ▲Technology
Semiconductors › Memory — DRAM, NAND & HBM ▲Technology
Artificial Intelligence › HBM & AI Memory Technology
Artificial Intelligence › AI Compute & Accelerator Silicon Technology
AMAT · Technology · Positive Applied Materials expanded EPIC Center R&D collaborations with KIOXIA on next-gen memory and with Besi on advanced packaging/interconnect for AI chips.
285A.JP · Technology · Positive KIOXIA joins Applied Materials' EPIC Center to advance next-generation memory technology.
BESI.AS · Technology · Positive Besi extends its longstanding partnership with Applied Materials to co-develop advanced packaging and interconnect technologies for AI-focused chips.